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Chip Industry’s Technical Paper Roundup: Jan 3
source link: https://semiengineering.com/chip-industrys-technical-paper-roundup-jan-3/
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Chip Industry’s Technical Paper Roundup: Jan 3
Area-efficient RISC-V decoupled vector coprocessor for HPC; rowhammer mitigation; HW accelerator; epitaxial graphene platform; power electronics; MTJ for stochastic computing; clock gating; paper-thin solar cells added to any surface; data transmission using inverse-designed silicon photonics.
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