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消息称苹果M3、M3 Pro芯片需求量下修
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消息称苹果M3、M3 Pro芯片需求量下修
《科创板日报》20日讯，近期供应链传出去年11月发布的Macbook M3/M3 Pro芯片需求量下修，市场推测消费力不振使得AI笔电热潮递延为主要因素，供应链载板、晶圆代工恐受到影响。法人指出，苹果M3／M3 Pro采用台积电3nm制程，恐将冲击3nm稼动率，此外，AMD CPU供应链指称，需求不如外界预期乐观，强力复苏言之尚早。台积电表示，不针对特定客户回应，第一季财测以法说会揭露讯息为主。 (台湾工商时报)
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