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Chip Industry’s Technical Paper Roundup: Apr. 4
source link: https://semiengineering.com/chip-industrys-technical-paper-roundup-apr-4/
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Chip Industry’s Technical Paper Roundup: Apr. 4
Demystifying CXL memory; physical design macro placement; 3-gated reconfigurable FETs; ALD for wafer bonding beyond silicon; self-adaptive HW with ReRAMs for neurocomputing; SiC & quantum nanophotonic HW; covert channel and PDN; scalable ALD for 2D semiconductors.
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