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Chip Industry’s Technical Paper Roundup: Nov. 29
source link: https://semiengineering.com/chip-industrys-technical-paper-roundup-nov-29/
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Chip Industry’s Technical Paper Roundup: Nov. 29
Carbon nanotube transistors; XDA Of flip-chip packaged FinFET devices; analog low-dropout voltage regulators; variations in silicon photonic circuits; EV charging cybersecurity; how 2D materials expand; vdW material properties; nanoscale 3D printing; 3D structuring inside GaAs by ULI.
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