Technical Paper Round-up: May 3
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Technical Paper Round-up: May 3
DRAM reliability; FeFET HW encryption; analog edge inferencing with ReRAM; image sensor; 2D magnetic materials; auto edge computing; CNP semi with 3D.
New technical papers added to Semiconductor Engineering’s library this week.
| Technical Paper | Research Organizations |
|---|---|
| A Case For Transparent Reliability In DRAM Systems | ETH Zurich and TU Delft |
| Analog Edge Inference With ReRAM | Applied Materials |
| HD Map (EdgeMap) Crowdsources Data From Connected Vehicles In Auto Edge Computing | University of Nebraska-Lincoln, Xidian University and University of North Carolina at Charlotte |
| Image Sensor Trained To Classify Optically Projected Images By Reading Out The Few Most Relevant Pixels | Institute of Photonics, Vienna University of Technology |
| Vertically Stacked, Low-Voltage Organic Ternary Logic Circuits Including Nonvolatile Floating-Gate Memory Transistors | KAIST and Gachon University |
| Die-Level Thinning And Integrating Route For Singulated MPW Chips Using Both Silicon Sensors And CMOS Devices | Silicon Austria Labs, Institute for Smart Systems Technologies, University of Edinburgh, Alpen-Adria-Universität Klagenfurt-Silicon Austria Labs |
| Current Knowledge & Future Development In 2D Magnetic Materials Research | Arizona State Univ., U of Michigan, Max Planck Institute, NYU, Columbia Univ and more.. |
| Pyrolyzed Cellulose Nanofiber Paper (CNP) Semiconductor With A 3D Network Structure | Osaka University, Univ. Of Tokyo, Kyushu Univ, Okayama Univ |
| AI-Based Method To Prune The Design Space Of Heterogeneous NoCs | Laboratoire d’Informatique de Robotique et de Microélectronique de Montpellier (LIRMM) & CNRS |
| Parallel Circuit Execution & NISQ Computing | LIRMM, University of Montpellier, CNRS |
| Hardware functional obfuscation with ferroelectric active interconnects (HW Encryption) | Penn State, Rochester Institute of Technology, GlobalFoundries Fab1, North Dakota State University |
Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us posting links to papers.
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